![]() ![]() ![]() My first try was to half the feedback resistance Rf of the Pierce oscillator (externally) but that didn't change anything. ![]() Is there a way to reduce this effect so no 67 kHz oscillations will occur? But the amplitude just seems so massive, that it seems like I hit another low frequency resonance of the resonator. It being piezoelectric of course also means that external vibration will be transformed into a voltage. Now I understand that a ceramic resonator contains some sort of piezoelectric ceramic element which has the resonance frequency you like. There are some variations which can happen like a combination of both frequencies: I measured this at the oscillator input of our ASIC. What I can measure with the oscilloscope is a spurious frequency of around 66 kHz which is close to double the frequency of the ultrasonic bath (35 kHz). If our device is put into an ultrasonic cleaning bath (electronic is sealed) the resonator starts to act up. It is optimized for the Murata CSTCC_G_A 2 MHz ceramic resonator. Our device uses a semi-custom IC which integrates the oscillator circuit, it's a simple Pierce oscillator with the matching resistors built into the ASIC. Specifically, the fatigue in MEMS is a major material reliability issue resulting in structural damage, crack growth, and lifetime measurements of MEMS devices in the light of statistical distribution and fatigue implementation of Paris' law for fatigue crack accumulation under the influence of undesirable operating and environmental conditions.I'm encountering a problem with a ceramic resonator as soon as our device is subjected to ultrasonic vibrations (ultrasonic cleaning bath). This study reviews some of the major reliability issues and failure mechanisms. Several technological factors, operating conditions, and environmental effects influencing the performances of MEMS devices must be completely understood. MEMS requires a high level of reliability. Commercialization is highly dependent on the reliability of these devices. MEMS industry is at the verge of transforming the semiconductor world into MEMS universe, apart from other hindrances the reliability of these devices is the focal point of recent research. MEMS can sense, actuate, and integrate mechanical and electromechanical components of micro-and nano sizes on a single silicon substrate using microfabrication techniques. The microelectromechanical system (MEMS) is one of the most diversified fields of microelectronics it is rated to be the most promising technology of modern engineering. This factor causes a delay in time-to-market. The complexity of the device to be tested required maturity in the test technique which increases the cost of test development this practice is directly imposed on the device cost. The accurate measurement of test systems for MEMS is difficult to quantify in the production phase. Currently, test systems developed for MEMS devices have to be customized due to their nondeterministic behavior and complexity. Therefore, testing of these systems at device level as well as at mass production level, that is, parallel testing, is becoming very challenging as compared to the IC test, because MEMS respond to electrical, physical, chemical, and optical stimuli. Their failure modes are distinctive under different circumstances. MEMS devices are more complex and extremely diverse due to the immersion of multidomains. The present review provides information relevant to issues and challenges in MEMS testing techniques that are implemented to analyze the microelectromechanical systems (MEMS) behavior for specific application and operating conditions. ![]()
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